I have 31 years of experience, and specialize in the field of semiconductor packaging with specific knowledge in the areas of flip chip, wafer level packaging (WLP) and thru silicon vias (TSVs). I have published on such topics as semiconductor packaging, flip chip bumping and assembly and wafer level packaging. I have testified on semiconductor packaging, MEMS packaging and molding technologies. The decision that I made in 1982 to focus on flip chip packaging at IBM. This enabled me to help lead the conversion to flip chip technology in the rest of the industry starting in the late 1990s while CTO of Flip Chip Technologies.